Standard, custom, or simply hard to find,
EPI is ready to help with your microelectronic package needs.
Hermetic Microelectronic Packages
Electronic Products (EPI) is a powder-to-package, fully-integrated HTCC technical ceramics package and glass-to-metal seal manufacturer for microelectronic applications. EPI is fully-equipped and vertically integrated in its 26,000 square foot, Newburyport, MA, ISO 9001:2015-registered manufacturing facility.
The EPI goal is to deliver turnkey, custom-designed and standard microelectronic packages for various industries and applications. In military and aerospace applications, EPI manufactures microelectronic hermetic packages for applications including communication systems, guidance/navigation/radar, optics, and more. Our microelectronic packages are also common in industrial applications with harsh environments including oil and gas instrumentation, process controls, and medical diagnostic equipment.
Partner with EPI to design a hermetic package solutions for harsh environments. Our broad range of sealing methods, plating materials, and proprietary processes allow for a combination of specialized hermetic feedthroughs for challenging environments.
TECHNICAL ADVANTAGES
- High-Temperature Co-Fired Ceramic (HTCC) multilayer AIN circuits fired at +1800°C are fully dense hermetic structures that provide low Coefficient of Thermal Expansion (CTE) and 170 W/mK Thermal Conductivity (TC). Ideally suited for high power electronics.
- Various ceramic materials to find the right material for the application include:
- Aluminas (AL2O3)
- Zirconia Toughened Alumina (ZTA)
- Aluminum Nitride (AIN)
- Matched and compression-based glass-to-metal seal capabilities in standard and customized packages in nickel, copper, silver, and gold.
- Hybrid hermetic packages combining our technologies to create unique solutions to solve challenging conditions.
CAPABILITIES
- Powder-to-package multilayer ceramic process capabilities up to 3” x 3” and up to 10+ layers.
- Hermetic hybrid packages that combine ceramic and glass-to-metal technologies in a single design.
- Screen printing in Tungsten, Molybdenum/ Manganese, and dielectrics.
- In-house tooling, plating, clean room processing, and inspection equipment to meet all quality requirements.
- Custom designs in various production volumes
- Microelectronic hermetic packages for high current and voltage ratings
- Small footprint, standard and custom microelectronic packages for optical, LEDs, sensing elements, and those with demanding focal plane arrays; packages available with clear flat or convex lenses.
- Standard and custom RF/microwave hermetic packages for military, aerospace, and satellite communications.
Hermetic Package Types
RF & MICROWAVE PACKAGES
OPTOELECTRONIC PACKAGES
POWER DISCRETE PACKAGES
TO PACKAGES & HEADERS
Unsure Where to Start?
Let’s Connect
Our team takes pride on the ability to provide technical support across a variety of applications. Tell us about your hermetic package requirements and we’ll work to find a solution together. We’re ready for the challenge.